TEC
Semiconductor refrigeration, also known as thermoelectric refrigeration, mainly utilizes the Peltier effect in the thermoelectric effect to achieve the purpose of refrigeration. The Peltier effect refers to the phenomenon of absorbing and releasing heat at a node when a direct current voltage is applied to a circuit composed of two different conductive materials. Therefore, adding a DC voltage to both ends of the P-N type node composed of special semiconductor materials with thermoelectric energy conversion characteristics can achieve cooling (heating) function. By changing the input voltage, the cooling capacity can be adjusted. This refrigeration technology is different from traditional steam compression refrigeration technology. It has neither refrigerant (no leakage or atmospheric pollution) nor complex mechanical equipment and piping systems. As long as the thermoelectric cooler is powered by direct current, it can achieve refrigeration (heating) efficiency in a very short time, which is both convenient and fast.
Key Features:
- Customized cooling capacity of 1-250W
- It can achieve both cooling and heating
- Thermoelectric refrigeration, without rotating components, with long reliability and lifespan
- High temperature control accuracy, ± 0.1 ℃
- Integrated design, compact structure
Application:
- Temperature control of battery cabinets/control cabinets
- Temperature control in enclosed spaces
Item | Description | TE0.5-D2D | TE01-D2D | TE02-D2D | TE25-D2D |
Parameters | Rated cooling power(W)@L32/L32 | 50 | 100 | 200 | 250 |
Rated power(W)@L35/L35 | 80 | 160 | 340 | 395 | |
Circulating air volume inside the cabinet (m ³/h) | 30 | 60 | 120 | 220 | |
Circulating air volume outside the cabinet (m ³/h) | 50 | 100 | 180 | 400 | |
Noise dB(A) | ≤60 | ≤62 | ≤65 | ≤70 | |
IP grade | IP55 | IP55 | IP55 | IP55 | |
Operating ambient temperature range (℃) | -40~+55℃ | -40~+55℃ | -40~+55℃ | -40~+55℃ | |
Power spec. | 24VDC | 24VDC | 48VDC | 48VDC | |
Control mode | Chip controller | Chip controller | Chip controller | Chip controller | |
Size W*D*H(mm) | 230×160×160 | 230×160×160 | 400×181×200 | 400×181×200 | |
Weight(kg) | 5 | 7 | 9 | 9 |
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ꄶ LIQUID COOLING
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In Rack L2A CDU
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In Row L2A Sidecar
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In Rack L2L CDU
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In Row L2L CDU
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Rear door liquid cooling
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Manifold
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Liquid cooling loop
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Immersion liquid cooling CDU&Tank
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Liquid cooling cabinet
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Liquid cooling EDU
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Closed cooling tower
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Mobile refill cart
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Liquid cooling server pressure maintain
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Server cleaning and injection equipment
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Server drain-dry-nitrogen injection
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Server test equipment transfer box
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Cold plate thermal performance testing
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Water purifier
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ꄶ HEAT EXTRACTION
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ꄶ FLUID CONTROL COMPONENT
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ꄶ AIR COOLING
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ꄶ HEATER