Switch Liquid Cooling Solution

The switch liquid cooling solution is designed for standard 1U switches, integrating Mac chip liquid cooling, double-layer optical module contact liquid cooling, and freely configuring liquid cooling for other modules to achieve complete cabinet liquid cooling.

The cooling medium is evenly distributed to the liquid cooling plates of each cooling circuit through the internal manifold of the chassis, and carries out heat. After absorbing heat, the cooling medium converges to the internal manifold of the chassis and enters the external pipeline ring network and secondary side CDU for heat exchange, forming a closed cooling cycle. The heat is transferred to the primary side cooling medium through the internal heat exchanger of the CDU, and then transported to the external cold source for heat dissipation through the EDU. The cooled cooling medium enters the CDU again through the primary side ring network for heat exchange, thus achieving the entire cabinet level cooling function.

Solution	Features
Mac chip cold board Double layer optical module cold plate Internal manifold Quick connector Leak detection rope	High integration, overall solution for internal heat sources in switches High reliability, the cold plate adopts integral brazing Flexible configuration, modular solutions make configuration more flexible Superior performance, the cold plate group adopts parallel pipelines, and each component has independent heat dissipation with small temperature difference and low flow resistance
Figure 1: Liquid cooling solution for switches