Vehicle chip TEC

Product Details

The car mounted chip TEC uses semiconductor active cooling technology to control the temperature of the heating chip. The TEC module consists of three main components: semiconductor cooling sheets, die-casting shells, and connectors. It also includes accessories such as adhesive materials used to connect semiconductor cooling sheets with die-casting shells, and NTC thermistors used to monitor the temperature of the TEC cold surface. When the TEC module is powered on, one side of the semiconductor refrigerant is cooled and the other side is heated. The generated cooling energy is diffused into the chip module through the thermal conductive gel, and the generated heat is diffused into the radiator outside the module through the die-casting shell and then distributed to the surrounding environment.

Key Features:

Customized cooling capacity of 0-10W
It can achieve both cooling and heating
Thermoelectric refrigeration, without rotating components, with long reliability and lifespan
High temperature control accuracy, ± 0.1 ℃
Integrated design with compact structure

Application:

Electronic chip temperature control

Item	Description	Vehicle chip TEC
Parameters	Rated cooling capacity (W)	10
	Rated power (W)	21
	Cold surface temperature (℃)	20
	Hot surface temperature (℃)	70
	IP grade	IP22
	Operating ambient temperature range (℃)	-40~+100℃
	Power specifications	7VDC
	Size LWH（mm）	51×27×8.5
	Weight（kg）	0.15

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Product Classification

ꂃ ꁹ