TTV
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TTV heating block

The TTV heating block adopts a thick film heating process, with a maximum power density of 300W/cm ². The substrate is made of aluminum nitride material, with high thermal conductivity and strong pressure bearing capacity. The TTV heating block can simulate the working state of chip heating by inputting voltage through the heating block.
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Product Details

The TTV heating block adopts a thick film heating process, with a maximum power density of 300W/cm ². The substrate is made of aluminum nitride material, with high thermal conductivity and strong pressure bearing capacity. The TTV heating block can simulate the working state of chip heating by inputting voltage through the heating block.

 

 

 

 

Key Features:

 

  • Small size, high heating power, maximum power density up to 300W/cm ²
  • Special metal sintering and heating process, with strong temperature resistance and high reliability
  • Aluminum nitride load-bearing substrate with high thermal conductivity, strong compressive performance, and uniform temperature
  • Uniformity and non-uniformity design to meet the needs of multiple heat sources
  • Infinite adjustment of heating power, integrated with temperature and power display

 

 

 

 

Application:

 

 

  • Simulate heat source heating

 

 

Power (W) Voltage (V) Resistance（Ω）@20~25℃ Size（mm） Heating area（mm） Power density（W/cm2）
200 220 242±5％ 43*25*2.5 25*25 32
250 220 193.6±5％ 74*50*3 50*50 10
550 220 88± 2%  115*62*3 78.46*31.1 22.54
800 220 60.5 ± 2%  49.2*32*3 32.3*25.6 96.75
1000 220 48.4±5％ 74*50*3 50*50 40
1500 240 38.4±2% 49.2*35*3 23.9*29.36 214.2
2500 220 19.36 ± 2%  74*50*3 48.6*48.2 106.72
2500 220 19.36±2% 49.2*35*3 32.3*25.6 300

 

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