DIMM内存条冷板
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DIMM cold plate

Suitable for liquid cooling of DIMM memory modules, the memory module cold plates are connected in series to the CPU cold plate group, taking away the heat of the memory modules through thermal conduction.
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Product Details

Suitable for liquid cooling of DIMM memory modules, the memory module cold plates are connected in series to the CPU cold plate group, taking away the heat of the memory modules through thermal conduction.

 

 

Features:

 

  • Single memory power consumption of 15W
  • Connected in series with the CPU cold board, with high integration
  • Memory modules are easy to plug and maintain

 

 

Item

Description

DIMM

Main performance parameters

Thermal design power consumption (W)

15W×32

Design pressure (bar)

5

Cold plate material

Purple copper T2

Pipe material

PTFE corrugated pipe

Medium

PG25

Supply liquid temperature (℃)

40

Supply fluid flow rate (LPM)

1.2

Flow resistance (kPa)

44.0

Thermal resistance (℃/W)

DDR5≤3

Heat-conducting medium

DDR5：thermal pad，8W/m·K

Size of thermal conductive medium

DDR5：126*22*0.45

Structure parameters

Surface treatment

Passivation

Leakage detection

Optional

Flow path form

Series connection

External interface

Barb

 

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Product Classification

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