TTV load bank

BEEHE TTV LOAD BANK SERIES
FOR GPU HEAT DISSIPATION PERFORMANCE VERIFICATION TEST
FOR LIQUID COOLING DATA CENTER VERIFICATION TEST

Product Details

BEEHE TTV LOAD BANK SERIES

FOR GPU HEAT DISSIPATION PERFORMANCE VERIFICATION TEST

FOR LIQUID COOLING DATA CENTER VERIFICATION TEST

PRODUCT FEATURES：

Small size, large heating power, maximum power density up to 300W/cm².
Rapid temperature rise, can simulate different heating power of GPU/CPU chips.
Special metal sintering heating process, strong temperature resistance, high reliability.
Aluminum nitride base plate, high thermal conductivity, strong compressive performance, uniform temperature.
Uniform and non-uniform heating area design to meet different application requirements.
Heating power stepless adjustment, integrated temperature, heating power real-time display.

BEEHE LOAD BANK PRODUCTS TECHNICAL PARAMETERS：

Product Classification

ꂃ ꁹ