Cooling loop, CPU/GPU cold plate

BEEHE COOLING LOOP SERIES
FOR GENERIC SERVERS AND AI SERVERS
INTEL EGS&BHS & AMD SP5
NVIDIA H100&B200&GB200&MGX

Product Details

BEEHE COOLING LOOP SERIES

FOR GENERIC SERVERS AND AI SERVERS

INTEL EGS&BHS & AMD SP5

NVIDIA H100&B200&GB200&MGX

PRODUCT FEATURES：

Optimal channel design, low flow resistance, no corrosion risk
Integrated connecting pipe location with a water tray, leakage detection design, safe and worry free
Material: copper, skiving process, good thermal conductivity, low thermal resistance
Brazing process, strong pressure bearing capacity, high reliability
Special anti-corrosion treatment process for the exterior and interior of the flow channel, safe and reliable
Standard leakage detection and alarm function
Over 95% of brazing surface brazing rate, safe and leak free
100% ultrasound CT inspection, quality controllable
100% air tightness, flow resistance, and cleanliness testing
100% draining and drying, nitrogen injection protection

CPU COLDPLATE TECHNICAL PARAMETERS：

Cooling object	Intel EGS	Intel BHS	AMD SP5
Installation methods	Combination screw	Combination screw	Spring screws
Cold plate material	Copper	Copper	Copper
Coolant	PG25	PG25	PG25
Connection pipe material	EPDM	PTFE + Silica gel	EPDM
Design maximum pressure	6Bar	10Bar	6Bar
Flow of tests	1.6LPM	1.2LPM	1.0LPM
Pressure drop	25kpa@12L/min	17kpa@1.2L/min	5kpa@1.0L/min
href="javascript:;" Inlet temperature	45℃	40℃	45℃
Tc/Tj	@385W*2 Tc＜55℃	@550W*2 Tc＜62℃	@400W*2 Tc＜57.3℃
Thermal conductivity of TIM	5.2W/m·K	5.2W/m·K	6.2W/m·K
Connector	UQD04 Socket	UQD02 Socket	UQD04 Socket

GPU COLDPLATE TECHNICAL PARAMETERS：

Product Classification

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